Advantages Similar to DAIP, but better resistance to alkalies. Disadvantages Similar to DAIP except : Lower temperature resistance (160°C/320°F compared with 180°C/360°F for DAIP). Tensile strength approximately 10% lower than DAIP. Applications As for DAIP provided the material is subject to lower operating temperatures.
Moulding compound: Electrical connectors, insulators, tool handles, pump impellers.
Coating resin: Sealant for metal castings and wood
Laminating resin: PCBs, high temp. applications, radomes, trunking